• Capability List

  • Capability
    Material TUC: TU-872 LK, TU-862 HF, TU-747 HF, TU-768, TU-668
    NAN YA: NP-140TL-B, NP-155F, NP-175F, NP-180R-TL-B, NPG-150N, CEM-1-97PM
    ITEQ: IT-140, IT-158, IT-180
    ShineMore: SM-730-4, SM-780F-5, SM-780F-8, SM-560-5
    ROGERS: RO4350B, RO4003C, RO4360, RT5870, RT5880, RT6002, RT6006, RT6010LM,
    RO3003, RO3006, RO3010, RO3035, RO3210, TMM10, TMM10i
    ARLON: 33N, 35N, 85N
    Isola: FR408, 370HR
    PKE: Nelco N4000-13, Nelco N4000-13 SI, Nelco N4000-13 EP, Nelco N4000-13 EP SI
    Mitsubishi: CCL-HL820WDI
    Doosan: DS-7402
    Layer Count (Max) 42
    Board Size (Max) 609.6x711.2 mm
    Board Thickness 8~280 mils
     Copper Weight 0.3~10 oz
    Line Width-Space (Min) Inner Layer 2 / 1.5 mils
    Outer Layer 2 / 2 mils
    Hole Size (Min) Mechanical 4 mils
    Laser 3 mils
    Hole Size Tolerance PTH ± 2 mils
    NPTH ± 1 mils
    Profile Feature Tolerance ± 4 mils
    Aspect Ratio 24:1
    Annular Ring (Min) 1.5 mils
    Dielectric Thickness (Min) 2 mils
    Layer to Layer Registration 3 mils
    True Hole Position 2 mils
    Controlled Impedance ± 5%
    Finished Surface Immersion Gold ( ENIG )、Immersion Silver、Immersion Tin、Electrolytic Gold (Hard Gold)、ENTEK(OSP)、HASL、Lead Free HASL、Carbon ink、etc.